Call for Papers | ECCE 2027

About the Conference

Chittagong University of Engineering & Technology (CUET) is one of the leading public universities of Bangladesh situated in the countryside 25 km away from the heart of the port city Chittagong. The Faculty of Electrical and Computer Engineering (ECE), CUET is going to organize the 5th International Conference on Electrical, Computer and Communication Engineering (ECCE) on January 2027 in CUET, Bangladesh. The goal of this conference is to bring together the leading academic scientists, researchers and scholars in various fields of Electrical, Computer and Communication Engineering around the world to exchange new ideas, share knowledge and explore recent developments in contemporary technologies.

Research Areas

Conference Tracks & Scope

Explore the major research areas and topics covered in the conference.

Electrical Power and Renewable Energy Systems

Electrical Machines and Drives
Power Electronics and Applications
Power System Analysis, Protection, and Stability
Smart Grid and Microgrid Technologies
Renewable Energy Systems
Solar Photovoltaic (PV) Systems
Energy Storage Technologies and Battery Management
Electric Vehicles (EVs) and Charging Infrastructure
High Voltage Engineering
Power Quality and Energy Management
Sustainable Energy Technologies

Computer Systems, Networks, and Cyber Security

Computer Architecture and High-Performance Computing
Computer Networks and Network Security
Cyber Security and Information Assurance
Embedded Systems and Internet of Things (IoT)
Cyber-Physical Systems
Edge, Fog, and Cloud Computing
Distributed and Parallel Computing
Blockchain and Secure Computing
Software Defined Networking (SDN)
Network Virtualization and Computing Systems

Communication Systems and Networking

Telecommunication Theory and Systems
Wireless Communication and Mobile Networks
Optical Fiber Communication and Networks
5G/6G and Beyond Communication Systems
Satellite and Space Communications
Internet of Everything (IoE)
Underwater and Vehicular Communication Systems
Network Protocols and Communication Security
Quantum Communication Technologies

Signal Processing, Biomedical Engineering, and Computer Vision

Analog and Digital Signal, Image, and Video Processing
Biomedical Engineering and Bioinformatics
Medical Imaging and Healthcare Technologies
Computer Vision and Pattern Recognition
Multimedia Processing and Applications
Speech, Audio, and Natural Language Processing
Human-Computer Interaction (HCI)
Augmented Reality (AR), Virtual Reality (VR), and Mixed Reality (MR)
Intelligent Healthcare Systems
Remote Sensing and Geospatial Signal Processing

Electronics, Materials, and Photonics

Photovoltaic Cells Design and Application
Electronic and Photonic Materials
Semiconductor Devices and Technologies
Optoelectronic Devices and Systems
Nanophotonics and Plasmonics
Photonic Technologies and Applications
Quantum Devices and Quantum Electronics
Flexible and Wearable Electronics
Advanced Functional Materials
Sensors and Smart Materials
Microwave and Terahertz Devices

Artificial Intelligence and Data Science

Artificial Intelligence and Machine Learning
Deep Learning, Reinforcement Learning and Imitation Learning
Explainable and Trustworthy AI
Data Science, Data Mining, and Analytics
Big Data and Cloud Computing
Algorithms and Computational Intelligence
Software Engineering and Database Systems
Biometrics and Intelligent Authentication
Generative AI and Large Language Models (LLMs)
AI Applications in Engineering and Healthcare

Robotics, Control, Automation, and Emerging Technologies

Robotics and Intelligent Automation
Control Systems and Industrial Automation
Autonomous and Unmanned Systems
Mechatronics and Smart Manufacturing
Intelligent Transportation Systems
Industry 4.0 and Smart Factory Technologies
Engineering Education for the Fourth Industrial Revolution (4IR)
Digital Twin and Smart Systems
Human-Robot Interaction
Emerging Interdisciplinary Technologies

VLSI, Microwave, and Integrated Systems Engineering

VLSI Circuits and Systems
Analog, Digital, and Mixed-Signal IC Design
Microwave and RF Engineering
Antennas, Propagation, and RF Systems
MEMS/NEMS and Nanotechnology
Sensor Technologies and Applications
Integrated Microsystems and System-on-Chip (SoC)
FPGA and Reconfigurable Computing
Low-Power and High-Speed Circuit Design
Hardware Security and Testing
IC Fabrication and Packaging Technologies

Downloads

Conference Flyer

Download Flyer

IEEE Paper Template

IEEE Template

Conference Support Acknowledgement

The Microsoft CMT service was used for managing the peer-reviewing process for this conference. This service was provided for free by Microsoft and they bore all expenses, including costs for Azure cloud services as well as for software development and support.